Background & Motivation
As semiconductor packages become increasingly complex, design decisions
must consider multi-physics reliability constraints from the earliest
design stages. However, conventional design flows rely heavily on
manual modeling and repetitive simulations, leading to long development
cycles and limited design exploration.
To overcome these limitations, our research focuses on building
virtual design environments that automate simulation setup, integrate
reliability metrics, and enable systematic design optimization.
Current Research Projects
Package Structure Design Optimization
Development of automated modeling and simulation workflows that reflect circuit layouts, material stacks, and structural design variables. The framework enables rapid evaluation of warpage, stress, and deformation during package design optimization.
Board-Level Reliability Prediction Automation
Construction of a virtual environment for real-time prediction of board-level reliability, including BLR metrics such as thermal cycling, drop, and mechanical loading. The system automates simulation execution, result extraction, and reliability assessment.
Production-Oriented Optimization & Deployment
Deployment of the optimized design framework into production-oriented environments. The system enables rapid assessment of reliability impacts due to design changes and supports decision-making for cost reduction and development cycle acceleration.
Methodology
- Automated generation of simulation-ready package and board models
- Integration of reliability metrics into design optimization loops
- Virtual environments for rapid design iteration and evaluation
Key Results & Impact
The proposed virtual design environments significantly reduce development time by minimizing manual modeling effort and enabling early-stage reliability evaluation. These tools support systematic design optimization and have been successfully applied to advanced package and board-level reliability problems.