Teaching & Education

Undergraduate and graduate education in semiconductor engineering, packaging, and computational mechanics

Courses Offered

Undergraduate Courses

Semiconductor Manufacturing

  • Overview of semiconductor manufacturing processes
  • Deposition, lithography, etching, and integration
  • Basic yield and reliability considerations

Programming

  • C++ programming fundamentals
  • Data handling and basic numerical routines
  • Programming for engineering applications

Semiconductor Packaging

  • Interconnects, substrates, and package structures
  • Thermal mismatch and warpage concepts
  • Introduction to packaging reliability

Graduate Courses

Advanced Packaging Technologies

  • 2.5D / 3D and heterogeneous integration
  • Chiplet-based system architectures
  • Thermal and mechanical challenges

Semiconductor Packaging Analysis

  • Finite element modeling (FEM)
  • Thermo-mechanical coupling analysis
  • Warpage and delamination prediction

Semiconductor Packaging Design

  • Package architecture and material stack design
  • Design optimization for reliability
  • Design-for-manufacturability concepts