Bond Tester
Quantitative evaluation of interfacial strength and failure modes of bonded joints in advanced packages.
- Shear / pull strength measurement
- Failure mode classification
- Interfacial reliability assessment
Micro / High-Temperature UTM
Micro-scale mechanical testing system enabling tensile, compression, and creep experiments under elevated temperatures.
- Micro-scale tensile & compression tests
- High-temperature mechanical characterization
- Constitutive model calibration
Solder Creep Tester
Long-term creep and viscoplastic behavior evaluation of solder joints for lifetime prediction.
- Time-dependent deformation measurement
- Creep & viscoplasticity analysis
- Reliability lifetime modeling